Preparation and properties of SiO2/polyimide photosensitive dry film
In order to obtain a high modulus photosensitive dry film,the photosensitive polyimide adhesive was prepared by mixing the polyimide resin,silica(SiO2),cross-linking agent,photoinitiator,coupling agent,etc.,then the photosensitive polyimide adhesive was coated on the carrier polyester film.After drying and cooling,and then coating with polyethylene film,the high modulus SiO2/polyimide photosensitive dry film DF-B was obtained,which could be made into cavity structure.The structure and properties of the photosensitive dry film with different SiO2 content(percentage of solid mass in the adhesive)were characterized and tested.The results show that the SiO2/polyimide photosensitive dry film is successfully prepared.With the increase of SiO2 content,the resolution of the photosensitive dry film DF-B gets worse.At 45 wt%of SiO2 content,the corresponding photosensitive dry film DF-B3 still has high resolution(30 µm).The thermal decomposition temperature and storage modulus of DF-B cured film increase with the increase of SiO2 content,the storage modulus of DF-B3 at 260℃can reach 4.2 GPa.The cavity structure formed by the photosensitive dry films DF-A(polyimide dry film)and DF-B3 is stable and the pattern is clear.In conclusion,the photosensi-tive dry film DF-B has excellent resolution,thermal stability and high modulus,and can be made into microscopic cavity structures.
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