首页|半导体介导MoS2/T-CoP复合异质结光催化降解染料污水

半导体介导MoS2/T-CoP复合异质结光催化降解染料污水

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半导体介导的多相光催化现在被认为是废水处理的有效方法.异质结被认为比单体具有更好的光催化活性.本工作通过简单的水热法制备了MoS2/T-CoP异质结,并研究了光催化降解罗丹明B与原始MoS2和T-CoP的比较.X射线衍射(XRD)和扫描电子显微镜(SEM)证实了MoS2和T-CoP之间复合异质结构的形成.采用紫外-可见漫反射光谱(UV-vis DRS)和电化学莫特-肖特基实验研究了MoS2和T-CoP的带隙.MoS2的导带边缘MoS2/T-CoP对罗丹明B表现出优异的光催化降解效率,1 h内达到71.01%.自由基捕获实验表明,h+是光催化降解的主要活性物质.这些结果表明,在MoS2上添加T-CoP可以有效增强MoS2/T-CoP异质结的光催化能力,其原因在于MoS2和T-CoP之间的匹配能带结构促进了界面电荷转移,抑制了光生电子与空穴在界面处的复合.
Semiconductor-mediated Photocatalytic Degradation of Dye Wastewater by MoS2/T-CoP Composite Heterojunction
Semiconductor-mediated multiphase photocatalysis is now considered an effective method for wastewater treatment.Heterojunctions are considered to have better photocatalytic activity than monomers.In this work,MoS2/T-CoP heterojunctions were prepared by a simple hydrothermal method and investigated for photocatalytic degradation of rhodamine B in comparison with pristine MoS2 and T-CoP.X-ray diffraction(XRD)and scanning electron microscopy(SEM)confirmed the formation of a composite heterostructure between MoS2 and T-CoP.UV-vis diffuse reflectance spectroscopy(UV-vis DRS)and electrochemical Mott-Schottky experiments were used to study the band gaps of MoS2 and T-CoP.The conduction band edge of MoS2 MoS2/T-CoP exhibited excellent photocatalytic degradation efficiency of rhodamine B,reaching 71.01%within 1 h.The photocatalytic degradation efficiency of T-CoP was also investigated by UV-vis DRS.Free radical trapping experiments showed that h+was the main active substance for photocatalytic degradation.These results suggest that the addition of T-CoP on MoS2 can effectively enhance the photocatalytic ability of MoS2/T-CoP heterojunction,which is attributed to the matching energy band structure between MoS2 and T-CoP that promotes the interfacial charge transfer and inhibits the complexation of photogenerated electrons and holes at the interface.

MoS2CoPheterojunctionwastewater treatment

张恺、许锋、田万超

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重庆理工大学,重庆 400051

二硫化钼 T-CoP 异质结 污水处理

2024

广东化工
广东省石油化工研究院

广东化工

影响因子:0.288
ISSN:1007-1865
年,卷(期):2024.51(7)
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