绝热层对界面粘接性能影响研究
Research on the Influence of Insulation Layer on Interface Bonding Performance
黄海龙 1李凤宇 2程靖萱 2李悦 1李东峰 1黄丹椿 1肖平 1尹文奇1
作者信息
- 1. 湖北航天化学技术研究所,湖北 襄阳 441003;航天化学动力技术重点实验室,湖北 襄阳 441003
- 2. 湖北航天化学技术研究所,湖北 襄阳 441003;应急救生与安全防护湖北省重点实验室,湖北 襄阳 441003
- 折叠
摘要
本文研究了丁腈橡胶(NBR)和三元乙丙橡胶(EPDM)两类绝热层的种类,以及绝热层的厚度、烘干条件等条件因素对端羟基聚丁二烯(HTPB)/异佛尔酮二异氰酸酯(IPDI)推进剂的界面粘接性能的影响.研究结果表明,NBR绝热层和EPDM绝热层对HTPB/IPDI推进剂的界面粘接性能均有明显的弱化作用.相比于EPDM绝热层,NBR绝热层对粘接性能的影响更大.随着NBR绝热层厚度的增加,对推进剂界面粘接性能的弱化作用加剧.通过对NBR绝热层的烘干预处理可以减弱绝热层对推进剂界面粘接性能的不利影响.
Abstract
The effect of the NBR and EPDM insulation layer on HTPB/IPDI interface bonding performance were investigated,including the thickness and drying condition.The results showed that whether NBR insulation layer display a more weakened effect on the interface bonding performance,compared with EPDM insulation layer.As the thickness of the NBR insulation layer increased,the decrease of interface bonding performance were more significant.The adverse effect of interface bonding performance can be reduced by drying the NBR insulating layer.
关键词
绝热层/丁腈/三元乙丙/界面粘接Key words
insulation layer/NBR/EPDM/interface bonding引用本文复制引用
出版年
2024
NETL
NSTL
万方数据