High Temperature and Thermal Aging Insulation Characteristics of Small Shell and Outer Frame for Press-pack IGBT
In recent years,IGBT have developed towards higher voltage and power densities.High voltages and high currents in limited space will sharply increase the probability of insulation failure at high temperatures.The encapsulation material exposed to high temperatures for a long time is facing the risk of insulation degradation and even failure.There-fore,it is urgent to conduct research on high temperature and thermal aging insulation properties in IGBT modules.This paper describes the high temperature and thermal aging characteristics of the small shell PA10T and outer frame UPM203 of the press-pack IGBT through the microscopic morphology,composition,dielectric constant,electrical conductivity,and surface flashover.The results show that the two materials irreversibly become yellow after thermo-oxidative aging,and functional group tests reveal that this phenomenon is related to an increase in colored functional groups.The dielectric and electrical conductivity are degraded after high temperatures and thermal aging.However,Outer frame still meets the requirements of the IEC standard(≤0.03).The flashover voltage of small shell and outer frame will drop by 27%and 29%,respectively,at a high temperature of 150℃.And the simulation results of band structure confirms the degradation be-havior of surface flashover.
万方数据
维普
