The Influence of Forming Space on Multi-Point Continuous Electromagnetic Forming Process
Because electromagnetic forming can improve the performance of material plastic forming,the use of magnetic collector in the electromagnetic system can realize the local processing of the workpiece,when the concentration in a small area of multiple forming,the distance between the two forming points is small and there is a local deformation of the area,which affects the uniformity of sheet metal forming.To investigate the interaction mechanism between local deformations during the point-by-point continuous electromagnetic forming process,using numerical simulation and experimental verification methods to explore the deformation behavior of the metal sheet during a continuous point-by-point electromagnetic forming process in a small area,revealing the influence of forming spacing on the electromagnetic force,strain and final forming effect involved in sheet metal forming.The results show that during the single electromagnetic forming,the plate is subjected to a circular distribution of electromagnetic force.The center of the forming point is subject to radial and tangential compressive strain and axial tensile strain,and its surroundings are subject to radial tensile strain and axial and tangential compressive strain.During multiple forming,as the distance between the two points decreases,the plate is affected by the deformation zones during the second forming,the influence range is 14 mm.The radial compressive strain and axial tensile strain on the center of the plate increase,and the electromagnetic force of the plate gradually increases.The forming height of the center of the second forming point increases gradually with the increase of the spacing between the two forming points,and the depth of the groove at the interface of the two forming points becomes deeper.The radial tensile strain at the interface of the two forming points shows a trend of first increasing and then decreasing with the increase of the forming distance.