Preparation and Performance of Naphthalene Biphenyl Bismaleimide Substrate for Packaging
In response to the new requirements for heat resistance of packaging substrate materials for high precision electronic chips,a heteronaphthalene biphenyl bismaleimide(DHPZBMI)and a new curing agent diallyl biphenol(DABP)were synthesized in order to prepare highly heat resistant packaging substrate materials.The composites were prepared by melt blending using DHPZBMI,DABP with benzoxazine(BOZ)modified commercial N,N'-(4,4'-diphenylmethane)bismaleimide(BDM)resin and hot pressing with glass fiber cloth.The curing process of the resin system was studied by DSC and FT-IR,while the rheological properties,thermal and mechanical properties were characterized.The results show that the system has a wide temperature range(>100℃)processing window,the initial decomposition temperature T5%is higher than 395℃,and a good thermal stability.The Tg of the composite also shows the same trend,and the Tg of BDDB/GF-1 is up to 314℃.The bending strength of the composite is up to 821 MPa,and the bending modulus is up to 41.2 GPa;the dielectric loss is as low as 0.011;the coefficient of thermal expansion is less than 45×10-6 K-1;the peel strength with copper foil is up to 1.025 N/mm.The system has good comprehensive performance and a broad application prospect in the field of packaging substrates.
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