In response to the new requirements for heat resistance of packaging substrate materials for high precision electronic chips,a heteronaphthalene biphenyl bismaleimide(DHPZBMI)and a new curing agent diallyl biphenol(DABP)were synthesized in order to prepare highly heat resistant packaging substrate materials.The composites were prepared by melt blending using DHPZBMI,DABP with benzoxazine(BOZ)modified commercial N,N'-(4,4'-diphenylmethane)bismaleimide(BDM)resin and hot pressing with glass fiber cloth.The curing process of the resin system was studied by DSC and FT-IR,while the rheological properties,thermal and mechanical properties were characterized.The results show that the system has a wide temperature range(>100℃)processing window,the initial decomposition temperature T5%is higher than 395℃,and a good thermal stability.The Tg of the composite also shows the same trend,and the Tg of BDDB/GF-1 is up to 314℃.The bending strength of the composite is up to 821 MPa,and the bending modulus is up to 41.2 GPa;the dielectric loss is as low as 0.011;the coefficient of thermal expansion is less than 45×10-6 K-1;the peel strength with copper foil is up to 1.025 N/mm.The system has good comprehensive performance and a broad application prospect in the field of packaging substrates.
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