含聚硅氧烷链段邻苯二甲腈树脂的制备及性能
Preparation and Performance of Polysiloxane-Containing Phthalonitrile Resin
蒋欣欣 1赵星诺 1章宇琳 1刘小僮 1王文蓓 1周权 1张钧钧1
作者信息
- 1. 华东理工大学特种功能高分子材料及相关技术教育部重点实验室材料科学与工程学院,上海 200237;上海富晨新材料有限公司,上海 201600
- 折叠
摘要
以端羟基聚二甲基硅氧烷和4-硝基邻苯二甲腈为原料,在强极性溶剂中进行亲核取代反应合成了含聚硅氧烷链段邻苯二甲腈树脂(SIPH),并利用氨基改性剂(AWL)与该树脂进行反应制备了改性含聚硅氧烷链段邻苯二甲腈树脂预聚物(SIPH-AL).通过红外光谱和核磁共振表征了SIPH树脂的化学结构;采用差示扫描量热法、红外光谱法、热重分析和动态力学热分析表征了SIPH-AL的固化行为和固化物的耐热性.结果表明,SIPH-AL起始固化温度为207℃,其固化物在空气和氮气中失重5%的温度(Td5)及1000℃质量保留率分别是453℃,29%和500℃,77%;石英纤维增强SIPH-AL复合材料室温和600℃时的弯曲强度分别为515.5 MPa和94.5 MPa,玻璃化转变温度(Tg)高于500℃.
Abstract
Polysiloxane-containing phthalonitrile resin(SIPH)was synthesized by nucleophilic substitution reaction of terminal hydroxypolydimethylsiloxane and 4-nitrophthalonitrile in a strong polar solvent,and modified polysiloxane-containing segment phthalonitrile resin prepolymer(SIPH-AL)was prepared by reaction with amino modifier(AWL).The chemical structure of SIPH resin was characterized by infrared spectroscopy(FT-IR)and nuclear magnetic(NMR).The curing behavior and heat resistance of SIPH-AL were analyzed by differential scanning calorimetry(DSC),FT-IR,thermogravimetric analysis(TGA)and dynamic thermomechanical instrument(DMA),and the results show that the initial curing temperature of SIPH-AL is 207℃,and the temperature of mass loss of 5%(Td5)and 1000℃ mass retention of the cured product under air and nitrogen are 453℃,29%and 500℃,77%,respectively.The flexural strength of quartz fiber reinforced SIPH-AL composite at room temperature and 600℃ is 515.5 MPa and 94.5 MPa respectively,and the glass transition temperature(Tg)is greater than 500℃.
关键词
含聚硅氧烷链段邻苯二甲腈树脂/氨基改性剂/耐热性/复合材料Key words
polysiloxane-containing phthalonitrile resin/amino modifier/heat tolerance/composites引用本文复制引用
基金项目
国家自然科学基金资助项目(52173074)
中央高校基本科研业务费专项(JKD01231701)
出版年
2024
NETL
NSTL
万方数据