Preparation of Non-Covalent Modified Graphene and Its Thermal Conductivity of Epoxy Resin Composites
Polyvinylpyrrolidone(PVP)modified graphene(GR@PVP)was prepared by non-covalent bond surface modification.EP/GR composites with different filling amounts were obtained by blending it with epoxy resin(EP).The results of FT-IR and thermogravimetric analysis(TGA)show that polyvinylpyrrolidone was successfully grafted onto the surface of graphene.The results of DMA and TG show that the storage modulus,glass transition temperature and loss factor peak height of EP/GR@PVP composites are lower than those of EP/GR composites,indicating that polyvinylpyrrolidone enhances the flexibility of epoxy resin composites.The fracture morphology of the composites was observed by scanning electron microscopy.GR@PVP is uniformly dispersed in epoxy resin and has good compatibility with the matrix.When the filler mass fraction is 2.0%,the thermal conductivity of EP/GR@PVP composites is 205.3%and 52.6%higher than that of pure EP and EP/GR composites,respectively.The apparent viscosity of EP/GR@PVP-2 composites at 25℃(13.29 Pa·s)meets the requirement of electronic packaging materials for the processing viscosity of composites(<20 Pa·s).This paper provided a simple method for further preparation of electronic packaging materials with high thermal conductivity and low viscosity.
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万方数据
维普
