Preparation and Properties of Thermally Conductive Electrically Insulative High Density Polyethylene-Based Composites
A combination of layered insulating hexagonal boron nitride(h-BN)and highly thermally conductive copper powder(Cu)was employed as fillers to enhance the thermal conductivity of high-density polyethylene(HDPE).The overall volume fraction of thermal conductive fillers was controlled at 30％,and the construction of thermal conduction pathways in the composite material was achieved by varying the blending ratio of h-BN and Cu powder in HDPE.Scanning electron microscopy results demonstrate that h-BN acts as bridge by entering the HDPE matrix unoccupied by Cu powder.h-BN facilitates the formation and construction of internal thermal conduction networks in HDPE by connecting surrounding Cu powder particles.Thermal conductivity results from HotDisk test indicate that as the h-BN/Cu volume ratio increases,the thermal conductivity coefficient of HDPE composite materials also increases.When V(h-BN)∶V(Cu)≤1,the thermal conductivity of the large-sized h-BN30/Cu system is higher than that of the small-sized h-BN05/Cu modified system;conversely,when V(h-BN)∶V(Cu)＞1,the contribution of small-sized h-BN05 to the thermal conductivity of the composite system is more pronounced compared to the large-sized h-BN30.By controlling the content of h-BN and Cu,an increase in the thermal conductivity coefficient of composite materials is achieved while suppressing the formation of conductive networks,offering a new solution for the design of thermally conductive insulation materials.
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