导热复合材料降低填料之间界面热阻研究进展
Progress in Decreasing the Thermal Interfacial Resistance Between Fillers for Thermally Conductive Composites
万炜涛 1潘晨 1郭呈毅 1王红玉 1陈田安 1徐友志1
作者信息
- 1. 深圳德邦界面材料有限公司,广东深圳 518100
- 折叠
摘要
复合材料热导率增强的低效率源于其内部存在界面热阻——填料与树脂基体之间的界面热阻及填料之间的界面热阻.目前大多数研究都集中于降低填料与树脂基体之间的界面热阻,而高填充量下填料之间的界面热阻才是影响复合材料热导率的关键因素.文中从增加填料之间的接触面积和提高填料之间的键接强度两方面综述了近年来降低填料之间界面热阻的研究进展,为高导热复合材料的设计和制备提供参考.
Abstract
The low efficiency of thermal conductivity enhancement of composites is due to the existence of interfacial thermal resistance:the interface thermal resistance between fillers and resin matrix,and the interface thermal resistance between fillers.Most of the existing studies were focused on decreasing the thermal interfacial resistance between fillers and resin matrix.While the interfacial thermal resistance between fillers is the key factor to determine the thermal conductivity of composites.This paper discussed the recent research results of reducing the interface thermal resistance between fillers from two aspects of increasing the contact area and improving the bond strength between fillers.This review offered some guidance for the design and fabrication of highly thermally conductive composites.
关键词
复合材料/热导率/填料/界面热阻Key words
composite/thermal conductivity/filler/thermal interfacial resistance引用本文复制引用
基金项目
深圳市高导热半导体热界面材料工程研究中心项目(2109-440307-04-01-417434)
出版年
2024
NETL
NSTL
万方数据