Thermal Conductivity of CF/h-BN/EPDM Composites and Numerical Simulation of Their Thermal Conductivity
With the rapid development of 5G communication,electronics and new energy vehicles,there is an increasing demand for thermal conductivity materials.Consequently,high-performance thermal conductivity composites have emerged as a prominent area of research.Considering the limitations associated with seepage and high-temperature volatilization of small molecule silicone oil in thermal conductive silicone rubber gaskets,they are not suitable for some applications requiring high cleanliness.Therefore,this study employed liquid ethylene-propylene-diene monomer rubber(EPDM)as matrix,and incorporated carbon fiber(CF)and hexagonal boron nitride(h-BN)as thermal conductive fillers to fabricate flexible thermal conductive composites without silicone oil leaking and VOC emission.Finite element simulation was utilized to simulate the thermal conductive behavior of the composites and predict the thermal conductivity of the composites filled with hybrid fillers at different volume ratios and fractions.The results demonstrate that the discrepancy between simulated and measured thermal conductivities is less than 10%,indicating good agreement between them.This study presented a novel approach for simulating and predicting the thermal conductivity of flexible thermal conductive composites filled with hybrid fillers.