摘要
近年来,聚酰亚胺广泛应用于高温器件,因此对材料的耐温性提出了更高要求.聚酰亚胺(PI)在300 ℃以上的高温环境中会发生热氧老化导致材料性能下降.文中介绍了聚酰亚胺薄膜的热氧老化机理以及改性方法.首先介绍了聚酰亚胺的分子结构改性,总结了在链段中引入苯并咪唑和苯并噁唑等刚性结构以提高聚酰亚胺薄膜热稳定性的方法.其次介绍了填料共混改性,总结了通过引入层状硅酸盐、碳化物或金属氧化物以及高导热填料杂化的方法进一步改善耐高温PI薄膜的热稳定性能.简要介绍了表面改性、涂层改性PI薄膜热氧化稳定性的国内外研究进展与发展现状.最后对耐高温、高导热PI膜未来发展的方向进行了总结与展望.
Abstract
In recent years,polyimide has been widely used in high temperature devices,so higher requirements are put forward for temperature resistance of materials.Polyimide in the high temperature environment above 300 ℃ will occur thermal oxygen aging,resulting in the deterioration of material properties.In this paper,the mechanism of thermo-oxygen aging of polyimide films and modification method were introduced.Firstly,the molecular structure modification of polyimide was introduced,and the methods of introducing rigid structures such as benzimidazole and benzooxazole into the chain segments to improve the thermal stability of polyimide films were summarized.Secondly,the modification of filler blend was introduced,and the thermal stability of PI films is further improved by introducing layered silicates,carbides or metal oxides and hybrid of high thermal conductivity filler.The research progress and development status of thermal oxidation stability of surface modified and coating modified PI films at home and abroad were briefly introduced.Finally,the future development directions of PI film with high temperature resistance and high thermal conductivity were summarized and prospected.
基金项目
辽宁省属本科高校基本科研业务费专项(LJ212410143006)
沈阳市中青年科技创新人才支持计划(RC210006)
大学生创新创业训练项目(S202310143031)
维普
万方数据