Research Progress of Controllable Debonding Adhesives Based on Dynamic Covalent Bonds
Thermosetting adhesives have the characteristics of excellent bonding properties,electrical insulation properties,chemical resistance,heat and high temperature resistance,and are widely used in automotive,electronics,power generation,aerospace and other fields.However,the three-dimensional cross-linked networks make thermosetting adhesives insoluble and non-melting,thus leading to the difficulties of rapid disassembling,maintaining and even recycling the bonded components or parts.Dynamic covalent bonds can be introduced into the cross-linked networks of adhesives to form covalent adaptable networks,which can result in reversible fracture of cross-linked networks under specific conditions,thereby achieving controllable debonding.Many studies have been carried out in the field of controllable debonding adhesives based on dynamic covalent bonds,and a series of new adhesives based on dynamic covalent bonds have been developed.This review mainly introduces the current research progress of controllable debonding adhesives based on dynamic covalent bonds,especially focuses on the basic principle of the design and preparation of these adhesives,summarizes the relationship between covalent adaptable network structures and properties of different types of controllable debonding adhesives,and looks forward to their development trends and challenges.
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