This paper focuses on the difficult processing of calcium silicate low temperature co-fired ceramic laminat-ed substrates,compares the effects of nanosecond and picosecond laser processing on CaSiO3 LTCC,as well as the composi-tion after laser action and the ablation characteristics of CaSiO3 LTCC under different laser parameters,and finally evaluates the feasibility of the two types of laser processing through the change of hardness.The results show that:the areas after both laser processing show the superposition of powder layer as well as recast layer,and the products of recast layer are CaSiO3,and the morphology after picosecond laser processing is better than that after nanosecond processing;the ablation depths of nanoseconds and picoseconds are in the ranges of 97.2~442.6μm and 161.7~461.7μm,respectively.With the increase of the laser power,and the decreases of the velocity and filling spacing,the ablation depth is basically linearly increasing.The laser power is the main factor affecting the ablation depth.The surface roughness at the top and bottom of the groove af-ter picosecond laser action are overall lower than that of nanosecond laser,with a minimum of 6.41μm after chemical mill-ing,whereas the hardness of the heat-affected zone on the surface after nanosecond action is reduced by 72.0%~77.2%,respectively,which is more favorable for subsequent machining treatment than that of picosecond laser processing.