首页|A heat transfer model for liquid film boiling on micro-structured surfaces
A heat transfer model for liquid film boiling on micro-structured surfaces
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High heat transfer coefficient(HTC)and critical heat flux(CHF)are achieved in liquid film boiling by coupling vibrant vapor bubbles with a capillary liquid film,which has thus received increased interest for thermal management of high-power electronics.Although some experimental progress has been made,a high-fidelity heat transfer model for liquid film boiling is lacking.This work develops a thermal-hydrodynamic model by considering both evaporation atop the wick and nucleate boiling inside the wick to simultaneously predict the HTC and CHF.Nucleate boiling is modeled with microlayer evaporation theory,where a unified scaling factor is defined to characterize the change of microlayer area with heat flux.The scaling factor η is found to be independent of wicking structure and can be determined from a few measurements.This makes our model universal to predict the liquid film boiling heat transfer for various micro-structured surfaces including micropillar,micropowder,and micromesh.This work not only sheds light on understanding fundamental mechanisms of phase-change heat transfer,but also provides a tool for designing micro-structured surfaces in thermal management.
liquid film boilingheat transfer modelcritical heat fluxheat transfer coefficientthermal management
Pengkun Li、Qifan Zou、Xiuliang Liu、Ronggui Yang
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School of Energy and Power Engineering,Huazhong University of Science and Technology,Wuhan 430074,China
State Key Laboratory of Coal Combustion,Huazhong University of Science and Technology,Wuhan 430074,China
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