Effect of Cu-doping content on the properties of Ag/LSCO electrical contact materials
王大帅 1曹旭丹 2杨芳儿 1郑晓华1
扫码查看
点击上方二维码区域，可以放大扫码查看
作者信息
1. 浙江工业大学 材料科学与工程学院,杭州 310014
2. 浙江大学 材料科学与工程学院,杭州 310027
折叠
摘要
采用溶胶凝胶法辅以高能球磨工艺合成Cu粉体改性La0.5Sr0.5CoO3-δ(LSCO)粉体,用粉末冶金工艺结合热挤压技术制备了系列Cu改性Ag/LSCO电接触材料与成品丝,研究了Cu粉体对改性 Ag/LSCO 材料界面润湿性、物理力学性能等影响规律.结果表明,随着 Cu 含量的增加,改性Ag/LSCO-xCu(x=0、1、2、4、6、8)电接触材料的电阻率呈先增加后减小的趋势,与 Ag和 LSCO基底的润湿角变化趋势相一致,但其密度和硬度性能变化趋势相反;当 Cu 含量为 4%时,Ag 和LSCO-4Cu基底的润湿角达最小值 55.0°,相应的成品丝(φ2.35 mm)性能最佳:电阻率 2.29 μΩ·cm,硬度(HV0.3)946.7 MPa,密度 9.73 g/cm3,断后延伸率 3.9%,为纯Ag/LSCO的 3.9倍.
Abstract
La0.5Sr0.5CoO3-δ(LSCO)powder was synthesized by sol-gel method and subsequently modified with Cu powder via high-energy ball milling process,and from Cu-modified Ag/LSCO powder a series of electrical contact materials including sheets and wires were prepared by powder metallurgy process combined with hot extrusion technique.The influence of Cu content on the interfacial wettability,physical and mechanical properties of Ag/LSCO materials was explored.The results showed that with the increase of Cu content,the resistivity of the modified Ag/LSCO-xCu(x=0,1,2,4,6,8)material presented a rising-declining change,consistent with trend in wetting angle changes between Ag and LSCO substrates.But for the change of density and hardness of Ag/LSCO-xCu,an opposite trend was observed.With a content of Cu at 4%,the wetting angle between Ag and LSCO-4Cu substrate reached a minimum value of 55.0°,and the modified Ag/LSCO wire(φ2.35 mm)displayed the best performance with the resistivity,hardness and density being 2.29 μΩ·cm,946.7 MPa and 9.73 g/cm3,respectively.Moreover,its corresponding break elongation reached up to 3.9%,3.9 times that of pure Ag/LSCO wire.
维普
万方数据