纯银溅射靶材的制备、微观结构及溅射成膜研究
Preparation,microstructure and film formation of pure silver sputtering target material
宁哲达 1唐可 1施晨琦 1闻明1
作者信息
- 1. 昆明贵金属研究所 云南贵金属实验室有限公司,昆明 650106
- 折叠
摘要
银薄膜作为高新技术领域极具潜力的新材料,在现代工业中得到了广泛的应用.以银靶为源材料的磁控溅射已成为制备银薄膜的常用方法.本研究比较了冷轧状态和退火状态下 Ag靶的溅射性能,探讨了Ag靶与Ag薄膜之间的关系.结果表明:冷轧变形量为 83.33%后进行 600℃退火可以有效提高 Ag{110}的织构密度.冷轧态和退火态 Ag靶具有相似的沉积速率.两种 Ag薄膜的电阻率均随溅射时间的延长而降低.在溅射时间相同的情况下,退火态 Ag靶溅射的 Ag薄膜电阻率低于冷轧态Ag靶溅射的Ag薄膜.退火态Ag靶组织均匀,溅射后溅射跑道较浅.
Abstract
As a promising new material,silver thin film has been widely used in modern industry.Magnetron sputtering with a silver target as the source has become a common method to produce silver film.In this research,the sputtering performance of Ag targets in cold rolling state and annealing state was compared and the relationship between the Ag targets and Ag thin films was explored.The results show that annealing at 600℃after cold rolling to a deformation of 83.33%can effectively increase the texture density of{110}in Ag.Both in the cold rolling state and annealing state,Ag targets exhibited a similar deposition rate.The resistivity of both kinds of Ag thin films decreases with the sputtering time.Ag thin films formed by sputtering Ag targets of two states for the same sputtering time displayed different resistivity,with the annealing state being superior over the rolling state.Ag target in annealing state,owing its uniform microstructure,showed shallower depth of rack track after sputtering.Annealing treatment after cold rolling is an alternative method to improve the target microstructure.
关键词
Ag溅射靶材/冷轧/再结晶退火/Ag薄膜/微观结构Key words
Ag sputtering target/cold rolling/recrystallization annealing/Ag thin film/microstructure引用本文复制引用
基金项目
云南省国际合作计划(2014IA037)
云南省创新团队项目(2019HC024)
云南省科技厅科研院所技术开发研究专项(2018DC004)
出版年
2024
NETL
NSTL
万方数据