银包覆法制备Ag-Cu-TiH2焊膏的研究
Preparation of Ag-Cu-TiH2 solder paste by the silver coating method
卢永伟 1刘满门 2张牧 3孙旭东3
作者信息
- 1. 东北大学 材料科学与工程学院 材料各向异性与织构教育部重点实验室,沈阳 110819
- 2. 贵研半导体材料(云南)有限公司,昆明 650503;云南贵金属实验室有限公司,昆明 650106
- 3. 东北大学 材料科学与工程学院 材料各向异性与织构教育部重点实验室,沈阳 110819;东北大学 佛山研究生创新学院,广东 佛山 528311
- 折叠
摘要
Ag-Cu-Ti钎料可以实现Cu和Si3N4 陶瓷的连接.然而,钎焊过程中Ti倾向于和Cu反应形成金属间化合物,降低了界面结合强度.本文采用化学还原法,以抗坏血酸为还原剂、Na2EDTA为分散剂,30℃保温 30 min,在Cu和TiH2表面包覆了一层均匀致密的Ag层.由于高活性的Ti降低了熔融 Ag 的表面张力,使得润湿角降低,焊料的铺展性能更好,此外,包覆 Ag 后显著抑制了焊膏中Ti和Cu的反应,提高了焊膏的活性,从而提高了覆铜板的界面结合强度.研究发现,包覆银的钎料在陶瓷上的铺展面积提高了 8.4%;制备的陶瓷覆铜板剥离强度提高了 16.7%.
Abstract
The Ag-Cu-Ti brazing filler metal enables the bonding of copper and Si3N4 ceramics.However,during the brazing process,Ti tends to react with Cu to form intermetallic compounds,leading to a reduction in the interfacial bond strength.In this paper,we used a chemical reduction method to coat a uniform and dense layer of Ag on the surfaces of Cu and TiH2 with ascorbic acid as the reducing agent and Na2EDTA as the dispersant,at 30℃ for 30 minutes.Due to the high activity of Ti,the surface tension of molten silver is reduced,decreasing the wetting angle between molten silver and Si3N4 and improving the spreading performance of the solder.Additionally,the significant suppression of the reaction between Ti and Cu in the solder paste by coating with Ag enhances the solder paste activity,thereby improving the interfacial bond strength of the copper clad laminate.The analysis results revealed the spreading area of silver-coated solder on ceramics increased by 8.4% and the peel strength of the prepared ceramic coated copper plate increased by 16.7% .
关键词
Ag-Cu-Ti/包覆银/Si3N4覆铜板/铺展性能/剥离强度Key words
Ag-Cu-Ti/silver coating/Si3N4-Cu clad plate/spreading performance/peel strength引用本文复制引用
出版年
2024
NETL
NSTL
万方数据