大功率器件低温烧结纳米银膏的研究进展
Development of low temperature sintering of nano silver paste for high power devices
鲍金祥 1关俊卿 1何金江 1王鹏 1侯智超1
作者信息
- 1. 有研亿金新材料有限公司 北京 102200
- 折叠
摘要
当前电子信息技术发展迅速,功率器件朝着高功率、高集成、小型化方向发展,但高功率给功率器件封装和热处理技术也带来了巨大挑战.纳米银膏可实现低温烧结高温服役,有着优异的电热学性能、机械可靠性和耐高温性能,因此广泛应用于大功率器件封装.本文归纳总结了纳米银膏的研究进展,从纳米银制备、银膏制备、烧结工艺等三个方面进行了展开说明.结合不同制备方法、优化还原工艺,可以更有效控制颗粒形貌与粒径,减少团聚;开发低沸点有机体系,掺杂不同电子材料可得到新型纳米银膏产品,从而满足低温烧结要求以及不同的烧结工艺和性能需要.
Abstract
Currently,the rapid advancement of electronic information technology is driving power devices towards higher power,greater integration,and miniaturization.However,this progress has also presented significant challenges in terms of packaging and heat treatment for high-power devices.Nano-silver paste offers low-temperature sintering capabilities combined with high-temperature performance,along with exceptional electrothermal properties,mechanical reliability,and resistance to high temperatures.As a result,it finds extensive application in the packaging of high-power devices.This paper provides a summary of research progress on nano-silver paste and illustrates advancements in three key areas:nano-silver preparation,silver paste preparation,and sintering processes.The particle morphology and size can be more effectively controlled through the combination of different preparation methods and optimization of reduction processes to reduce agglomeration.Furthermore,by developing an organic system with a low boiling point and incorporating various electronic materials as dopants,new nano-silver paste products can be obtained to meet the requirements for low-temperature sintering across different processes.
关键词
封装材料/纳米银膏/低温烧结/烧结工艺Key words
packaging material/nano silver paste/low temperature sintering/sintering process引用本文复制引用
出版年
2024
NETL
NSTL
万方数据