高技术通讯(英文版)2024,Vol.30Issue(2) :170-178.DOI:10.3772/j.issn.1006-6748.2024.02.008

Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module

刘璇 ZHANG Mingchao LIU Chengwen ZHOU Chuanan LV Xiaoling
高技术通讯(英文版)2024,Vol.30Issue(2) :170-178.DOI:10.3772/j.issn.1006-6748.2024.02.008

Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module

刘璇 1ZHANG Mingchao 1LIU Chengwen 1ZHOU Chuanan 1LV Xiaoling1
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作者信息

  • 1. School of Mechanical Engineering,Hebei University of Technology,Tianjin 300401,P.R.China
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Abstract

With the widespread use of high-power and highly integrated insulated gate bipolar transistor(IGBT),their cooling methods have become challenging.This paper proposes a liquid cooling scheme for heavy-duty automated guided vehicle(AGV)motor driver in port environment,and im-proves heat dissipation by analyzing and optimizing the core component of finned heat sink.Firstly,the temperature distribution of the initial scheme is studied by using Fluent software,and the heat transfer characteristics of the finned heat sink are obtained through numerical analysis.Secondly,an orthogonal test is designed and combined with the response surface methodology to optimize the structural parameters of the finned heat sink,resulting in a 14.57%increase in the heat dissipation effect.Finally,the effectiveness of heat dissipation enhancement is verified.This work provides val-uable insights into improving the heat dissipation of IGBT modules and heat sinks,and provides guidance for their future applications.

Key words

finned heat sink/insulated gate bipolar transistor(IGBT)module/heat dissipa-tion/orthogonal test/response surface methodology

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基金项目

National Key Research and Development Plan Program(2022YFB4701101)

国家自然科学基金(U1913211)

河北省自然科学基金(F2021202062)

出版年

2024
高技术通讯(英文版)
中国科学技术信息研究所(ISTIC)

高技术通讯(英文版)

影响因子:0.058
ISSN:1006-6748
参考文献量23
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