Effect of alumina particle size on thermal conductivity of phenolic resin
Polymer materials such as epoxy and phenolic resin are widely used in the field of thermal manage-ment materials because of their good electrical insulation properties,chemical stability and easy processing properties.However,the low inherent thermal conductivity of polymer materials limits their wide application.In this work,multi-scale spherical Al2O3 particles were introducedinto phenolic resin(PF)matrix to improve its heat transfer performance.We focused on the study of the influence of Al2O3 particle size and Al2O3 loading on thermal conductivity and thermal stability of PF composites.The results show that the thermal conductivity of the Al2O3/PF composite is up to 1.611 W/(m·K)at the total fillers loading is 75 wt％(the weight ratio of Al2O3 particles with large and small sizes is 1∶1),which is nearly 8 times higher than that of pure PF.At the same time,the thermal conductivity achieved is higher than that of PF composites with only small particles or large particles added.This is attributed to the fact that when the multi-scale spherical Al2O3 particle hybridized,the Al2O3 particles with small particle size filled the gaps between the Al2O3 particles with large particle size,constructing more heat transfer pathways in the matrix.The TG results show that the thermal stability of PF composites with Al2O3 fillers is improved,and the maximum decomposition temperature of Al2O3/PF compos-ites is increased from 517 ℃ to 543 ℃.Therefore,our work provides a new idea for the preparation of high-per-formance polymer composites.
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维普
