Preparation and research of epoxy/polyester composite resin conductive silver paste
In this paper,the rheological,electrical and mechanical properties of silver paste with different blends of epoxy resin and polyester resin were studied.The thixotropy and thixotropy recovery rate of resin silver paste were studied by rheometer,and the effect of rheology on printing film was discussed.In situ curving resistance test method was used to monitor the change of thermal curing resistance of silver resin paste.The results showed that the content of epoxy resin in silver paste had great influence on the resistance.The adhesion strength of resin silver paste on A12O3 substrate was evaluated by the thrust test method,and the thermal im-pact performance of resin silver paste was evaluated.The results showed that when the ratio of epoxy resin to polyester resin was 1:0.6,the viscosity of C-1 silver paste was moderate,the thixotropic recovery rate was 58.03％after 10 s,and the printing surface was flat.After curing at 200 ℃ for 30 min,the resistance is about 2 Ω,the adhesion strength is about 10 N/mm2,and the adhesion strength is not significantly deteriorated after ther-mal shock at 260 ℃.The comprehensive performance is better,and it is suitable for the process requirements of electronic components.
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