Preparation and reliability test of diamond/aluminum composites
Diamond/aluminum composites have the advantages of high thermal conductivity and low density,making them ideal cooling materials for aerospace electronic devices.However,there is a lack of comprehensive research on the factors influencing the thermal conductivity of diamond/aluminum composites,as well as their reliability.In view of the above problems,spark plasma sintering method was utilized to prepare diamond/alu-minum composites with a thermal conductivity of 462 W/(m·K).It considered the effects of sintering temper-ature,holding time,and diamond particle size combination.Additionally,the heat spreader reliability of this di-amond/aluminum composite in high and low temperature and vibration environment was studied.The results demonstrated that the diamond/aluminum composite effectively reduced the heat source temperature by 13 ℃ compared to aluminum alloy when subjected to a heat flux of 70 W/cm2.Furthermore,diamond/aluminum composites can maintain stable physical properties and structural reliability in the high and low temperature and vibration environment,effectively exerting their heat dissipation capacity.Overall,diamond/aluminum compos-ites can be presented as a reliable solution for heat dissipation in aerospace electronic devices.
diamond/aluminum compositesthermal conductivityheat dissipationhigh and low temperaturevi-bration
万方数据
维普
