Diamond/aluminum composites have the advantages of high thermal conductivity and low density,making them ideal cooling materials for aerospace electronic devices.However,there is a lack of comprehensive research on the factors influencing the thermal conductivity of diamond/aluminum composites,as well as their reliability.In view of the above problems,spark plasma sintering method was utilized to prepare diamond/alu-minum composites with a thermal conductivity of 462 W/(m·K).It considered the effects of sintering temper-ature,holding time,and diamond particle size combination.Additionally,the heat spreader reliability of this di-amond/aluminum composite in high and low temperature and vibration environment was studied.The results demonstrated that the diamond/aluminum composite effectively reduced the heat source temperature by 13 ℃ compared to aluminum alloy when subjected to a heat flux of 70 W/cm2.Furthermore,diamond/aluminum composites can maintain stable physical properties and structural reliability in the high and low temperature and vibration environment,effectively exerting their heat dissipation capacity.Overall,diamond/aluminum compos-ites can be presented as a reliable solution for heat dissipation in aerospace electronic devices.
关键词
金刚石/铝复合材料/热导率/电子器件散热/高低温/振动
Key words
diamond/aluminum composites/thermal conductivity/heat dissipation/high and low temperature/vi-bration
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