首页|Cu掺杂Ti-Si多孔膜材料的制备及其孔隙性能研究

Cu掺杂Ti-Si多孔膜材料的制备及其孔隙性能研究

扫码查看
采用加压原位反应烧结技术成功制备了 Cu掺杂Ti-Si金属间化合物多孔膜材料。利用扫描电子显微镜(SEM)、能谱仪(EDS)、X射线衍射仪(XRD)和电子万能试验机等测试设备对不同烧结温度、不同Cu掺杂量条件下制备的Ti-Si多孔膜材料进行了表征分析。实验结果表明,所制备的多孔膜表面主要物相均为Ti5Si3,并伴有少量TiCu和Ti-O化合物次生相生成;生成的Ti-Si多孔膜层表面颗粒大小为0。5~2μm,膜层厚度为6~10 μm。随着Cu粉掺杂量的增加或烧结温度的升高,膜材料的最大冒泡孔径和相对透气系数呈降低趋势,最大冒泡孔径在24~29μm之间,相对透气系数范围为33~97 m3/(m2·h·kPa)。Cu掺杂可以促进Ti-Si体系原位反应的进行:在加速Ti5Si3多孔膜生成的同时提高了膜层与基体的结合强度,Cu掺杂量为5%(质量分数)、900℃时制备样品的膜/基结合强度达到了 19。18 MPa。
Preparation and pore properties of Cu doped Ti-Si porous membrane materials
The Cu-doped Ti-Si intermetallic porous membrane materials were successfully prepared by pressure in-situ reaction sintering.The Ti-Si porous membrane materials prepared at different sintering temperature and Cu doping amounts were characterized by scanning electron microscope(SEM),energy dispersive spectrometer(EDS),X-ray diffractometer(XRD)and electronic universal testing machine.The experimental results showed that the main phase of the membrane was Ti5Si3,accompanied by a small amount of TiCu and Ti-O compound secondary phase formation.The surface particle size of the Ti-Si porous membrane was 0.5-2 μm,and the thick-ness of the membrane layer was 6-10 μm.With the increase of Cu powder doping amounts or sintering tempera-ture,the maximum bubble pore size and the relative permeability coefficient decreased.The maximum bubble pore size is between 24-29 μm,and the relative permeability coefficient ranged from 33 to 97 m3/(m2·h·kPa).Cu doping can promote the in-situ reaction of Ti-Si system.It accelerated the formation of Ti5Si3 porous membrane and increased the bonding strength between the membrane layer and the substrate.When the Cu do-ping amount was 5wt%with the sintering temperature of 900 ℃,the membrane/substrate bonding strength of the prepared sample reached up to 19.18 MPa.

Ti-Si systemin-situ reactive processporous membraneCu-doped

焦燕妮、刘忠军、雷娟、姬帅、敖庆波

展开 >

西安石油大学材料科学与工程学院,西安 710065

西北有色金属研究院金属多孔材料国家重点实验室,西安 710016

Ti-Si体系 原位反应 多孔膜 Cu掺杂

2024

功能材料
重庆材料研究院 中国仪器仪表学会仪表材料学会

功能材料

CSTPCD北大核心
影响因子:0.918
ISSN:1001-9731
年,卷(期):2024.55(12)