首页|Interface optimization of graphene paper-Cu composite prepared by electrodeposition

Interface optimization of graphene paper-Cu composite prepared by electrodeposition

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A room-temperature electrodeposition method with an organic electrolyte was developed to fabricate a HNO3-pretreated graphene paper Cu(GP'-Cu)composite.To improve the interfacial bonding of GP'-Cu composite,magnetron sputtering technology was used to create a"sandwich"structural gradient GP'-Cu composite.The selection of the intermediate transition layer metal was based on two-dimensional disregistry.Scanning electron microscopy,X-ray photoelectron spectroscopy,and other analytical methods confirmed that the addition of an intermediate transition metal(Cr,Ni)layer reduced the gap distance and enhanced the interfacial bonding of the GP'and Cu deposited layers.The GP'-Ni-Cu composite exhibited the largest increase in tensile strength and conductivity.In addition,it had the highest thermal diffusivity and elongation at break among the GP'-Cu,GP'-Cr-Cu and GP'-Ni-Cu composites.

Graphene paperTwo-dimensional disregistryMagnetron sputteringMetal composite

Jing Guo、Hai-jing Wang、Shuang-juan Liu、Peng Zhang、Jing-yu Tang、Wei-yang Zhang、Han-jie Guo、Peng-cheng Wang、Cai Meng

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School of Metallurgical and Ecological Engineering,University of Science and Technology Beijing,Beijing 100083,China

Institute of High Energy Physics,Chinese Academy of Sciences,Beijing 100049,China

Advanced Technology and Materials Co.,Ltd.,Beijing 100083,China

School of Nuclear Science and Technology,University of Science and Technology of China,Hefei 230027,Anhui,China

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Key Laboratory of Particle Acceleration Physics& Technology,Institute of High Energy Physics,Chinese Academy of SciencesKey Laboratory of Particle Acceleration Physics& Technology,Institute of High Energy Physics,Chinese Academy of SciencesNational Natural Science Foundation of ChinaYouth Innovation Promotion Association CASNational Natural Science Foundation of China Youth ProjectFundamental Scientific Research Business Expenses of Central UniversitiesFundamental Scientific Research Business Expenses of Central UniversitiesFundamental Scientific Research Business Expenses of Central UniversitiesFundamental Scientific Research Business Expenses of Central Universities

JSQ2022KF01JSQ2020ZZ0512035017201901651704021FRF-IDRY-20-015FRF-TP-20-004A3FRF-TP-19-030A2FRF-TP-16-079A1

2024

10.1007/s42243-023-01134-w

钢铁研究学报(英文版)
钢铁研究总院

钢铁研究学报(英文版)

CSTPCD
影响因子：0.584
ISSN：1006-706X
年,卷(期)：2024.31(1)
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