首页|Effect of trace Zn addition on electromigration of Cu/Sn-10Bi/Cu solder joints
Effect of trace Zn addition on electromigration of Cu/Sn-10Bi/Cu solder joints
扫码查看
点击上方二维码区域，可以放大扫码查看
原文链接
NETL
NSTL
万方数据
The electromigration reliability on Sn-10Bi solder joints is investigated and the performance is tried to be improved with trace Zn addition in solder by depressing the growth of interfacial intermetallic compounds(IMCs)under electromigration.The electromigration test was realized on Cu/solder/Cu linear specimens at a current density of 1.0×104 A/cm2 with different stressing time.It was found that Bi atoms in Cu/Sn-10Bi/Cu solder joint were driven towards anode side under current driving force and then accumulated at anode interface with current stressing time increasing.The thickness and growth rate of Cu6Sn5 IMCs at anode interface were obviously larger than those at cathode side due to polarity effect.The addition of 0.2 wt.%Zn inhibited the migration of Bi atoms during the electromigration process,and the composition of interfacial IMCs was transformed into Cu6(Sn,Zn)5,which played as a diffusion barrier to effectively reduce the asym-metric growth of IMCs and the consumption of Cu substrate during electromigation.
NETL
NSTL
万方数据
