首页|Optimization of multicomponent SnBiInSbx low-temperature solder with varied Sb contents
Optimization of multicomponent SnBiInSbx low-temperature solder with varied Sb contents
扫码查看
点击上方二维码区域，可以放大扫码查看
原文链接
NETL
NSTL
万方数据
The drive toward miniaturization,functionalization,and environmental conservation in electronic devices has increased the demand for low-temperature solder in 3D packaging processes.The influence of Sb incorporation on the structure and properties of SnBiIn solder at an equal molar ratio is investigated.It is demonstrated that Sb incorporation facilitates the formation of SnIn phase and induces the precipitation of spherical Bi particles.Furthermore,the concentration of Sb directly affects the morphologies of both Bi and SbIn phases.The amount of Sb also directly impacts the morphologies of Bi and SbIn phases,resulting in distinct solid solution and second-phase strengthening effects.These effects consequently alter the properties of the solder.This phenomenon arises because Sb hinders atomic diffusion within the joint,leading to the formation of thin Cu6(Sn,In)5 intermetallic compounds.It can be reasonably inferred that lead-free low-temperature solders,based on high-entropy alloy multicomponent compositions and engineered via elemental modulation,show pro-mise for successful applications in electronic packaging.
Shan-nan Zhang、Tian-ran Ding、Zong-ye Ding、Shi-yan Xie、Fu-li Liu、Su-juan Zhong、Jie Liu、Shuai-jie Ma
展开 >
State Key Laboratory of Advanced Brazing Filler Metals&Technology,Zhengzhou Research Institute of Mechanical Engineering Co.,Ltd.,Zhengzhou 450001,Henan,China
School of Mechatronic Engineering and Automation,Foshan University,Foshan 528225,Guangdong,China
College of Materials Science and Engineering,Taiyuan University of Science and Technology,Taiyuan 030024,Shanxi,China
Key Research and Development Projects in Henan Province,China
NETL
NSTL
万方数据
