焊接工艺对Q345厚板电子束封装淬硬裂纹的影响
Effect of welding process on hardened cracks in electron beam package of Q345 ultra-thick plate
张潜 1骆宗安 1成小龙 2周兰聚 2周宏宇 1刘照松1
作者信息
- 1. 东北大学轧制及连轧自动化国家重点实验室,辽宁沈阳 110819
- 2. 山东钢铁集团日照有限公司科技质量中心,山东 日照 276805
- 折叠
摘要
针对Q345特厚板在电子束焊接封装时易产生淬硬裂纹的问题展开分析,探究了焊接工艺对焊缝成形的影响,提出了消除裂纹的有效措施,并测试了不同焊接工艺下焊接接头的力学性能.结果表明:当热输入从7.2 kJ/cm升到9.6kJ/cm时,裂纹尺寸和数量明显减少,而热输入增加至11.52 kJ/cm时,焊缝表面成形恶化,并在根部产生钉尖缺陷.对于热输入为9.6 kJ/cm的焊接接头,通过焊前预热100℃及焊后缓冷措施,能够完全消除淬硬裂纹.对7.2、9.6 kJ/cm,9.6 kJ/cm预热+空冷和9.6 kJ/cm预热+缓冷的4种接头进行显微硬度测试,焊缝平均硬度分别为431HV、418HV、369HV和339HV.拉伸试验表明,4种拉伸试样断裂位置皆位于母材,达到了封装质量标准,强度分别为547、543、524和500 MPa.
Abstract
Aiming at the hardening crack problem of Q345 thick plate in electron beam welding package,the influence of the welding process on the formation of the weld was explored,effective measures to eliminate the cracks were proposed,and the mechanical properties of welded joints under different welding processes were tested.The results show that when the heat input increases from 7.2kJ/cm to 9.6kJ/cm,the size and number of cracks significantly decrease.However,when the heat input increases to 11.52 kJ/cm,the surface formation of the weld deteriorates and nail tip defects occur at the root.For the welded joint with heat input of 9.6 kJ/cm,the hardening cracks can be completely eliminated by preheating 100℃ before welding and slow cooling after welding.The micro hardness test was carried out for the four types of joints with 7.2 kJ/cm,9.6 kJ/cm,9.6 kJ/cm preheating+air cooling and 9.6 kJ/cm preheating+slow cooling.The average hardness of the weld seams are 431HV,418HV,369HV and 339HV,respectively.The tensile test shows that the fracture positions of the four tensile specimens are all located in the base material,and the strength of four welding joint are 547,543,524 and 500 MPa,respectively,which can satisfy the packaging quality standard.
关键词
电子束焊接/特厚板/淬硬裂纹/热输入/预热Key words
electron beam welding/extra thick plate/hardening crack/heat input/preheat引用本文复制引用
基金项目
国家自然科学基金(52105322)
国家重点研发计划(2018YFA0707300)
山东省重点研发计划(2020CXGC010304)
出版年
2023
NETL
NSTL
维普
万方数据