成型工艺对黏土结合碳化硅制品性能的影响
The influence of molding process on the properties of clay bonded silicon carbide products
孙立岩1
作者信息
- 1. 中钢集团洛阳耐火材料研究院有限公司,洛阳 471023
- 折叠
摘要
以碳化硅、硅微粉为主要原料,以粘土为结合剂,制备出粘土结合的碳化硅制品.探究了不同成型压力(100 MPa、150 MPa、180 MPa、200 MPa和 230 MPa)和颗粒级配对碳化硅制品显微结构及其性能的影响.结果表明:当添加质量分数 17%的碳化硅细粉时,体积密度值为 2.42 g/cm3;常温耐压强度和常温抗折强度分别为 83.46 MPa和17.4 MPa;同时抗氧化性得到进一步改善.当成型压力为230 MPa时,压制的试样的机械性能和抗氧化性均达到最大值.
Abstract
Clay bonded silicon carbide products are prepared with silicon carbide and silica powder as the main raw materials and clay as the binder.The influence of different moulding pressures(100 MPa,150 MPa,180 MPa,200 MPa,and 230 MPa)and particle grading on the microstructure and properties of silicon carbide products are studied.The results show that when 17%silicon carbide fine powder is added,the bulk density value is 2.42 g/cm3,and the room temperature compressive strength and flexural strength are 83.46 MPa and 17.4 MPa,respectively;meanwhile,the oxidation resistance has been further improved.When the molding pressure is 230 MPa,the mechanical properties and oxidation resistance of the pressed samples reach their maximum values.
关键词
碳化硅材料/颗粒级配/成型压力/抗氧化性Key words
Silicon carbide material/Particle grading/Pressing pressure/Oxidation resistance引用本文复制引用
出版年
2024
NETL
NSTL
万方数据