Mechanism for laser-induced damage bad chip of Micro-LED and optimization of processing parameters
To improve the manufacturing quality of Micro-LED display panels,it is crucial to perform in-situ removal and repair of defective chips.This study introduces a laser two-temperature ablation model de-veloped with COMSOL to explore the mechanisms and process parameters for eliminating defective chips using a laser.Initially,the ablation threshold of the Micro-LED was identified by measuring the square di-ameter of the surface spot created by a single-pulse laser ablation.A fitting analysis was then carried out to determine the relationship between laser parameters and ablation depth,confirming the accuracy of the two-temperature ablation model.An extensive analysis was also conducted to examine the laser spot over-lap rate,laser fluence,ablation characteristics,and removal mechanisms for different scanning paths on the affected chips.Utilizing the two-temperature ablation model,the laser scanning path and process pa-rameters were optimized.The findings reveal that the femtosecond laser ablation model for Micro-LED has a maximum analytical error of 9.28%.The optimized laser removal method allows for rapid and pre-cise removal at a rate of 1 s/chip,while ensuring high-quality repair of pad surfaces.This provides essen-tial guidance for efficient repair processes in large-scale production environments of large-format Micro-LED display panels.
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维普
