Vertical clamping deformation analysis and validation of 300 mm wafer warpage detection
To address the challenges of detecting additional deformation errors caused by external forces during wafer warpage detection-errors that are difficult to eliminate and quantify-this paper proposes an im-proved vertical automatic clamping solution for rapid and high-precision industrial wafer warpage detection.By leveraging theoretical analysis,finite element simulations,and wafer warpage characterization meth-ods,the paper introduces an analytical approach to wafer clamping design,elucidating the relationship be-tween key design parameters and additional wafer warpage.The study achieves forward design of critical parameters for the vertical clamping mechanism,with validation experiments for production and repeated clamping based on the design results.Analysis and experimental outcomes demonstrate that vertical clamp-ing can ensure the additional bow of a 300 mm single-crystal silicon wafer does not exceed 70 nm,and the warp remains under 1 000 nm,provided that the wafer attitude tilt angle is less than 0.02°,the bottom fixed constraint position slope angle is 35°±1°,and the clamping force is not more than 2 N with an angle not exceeding 2° from the vertical direction.This research offers practical guidance for developing a high-precision geometric profiling instrument for 300 mm wafers and large-size optical component clamping.
wafer warpage measurementvertical clampingadditional deformationfinite element analysis
万方数据
维普
