Research on Electrical-heating Co-simulation and Heat Dissipation of 10 Gigabit Ethernet Modules
During the operation of a 10 GB Ethernet module,the PHY chip generates significant heat,which can lead to performance degradation or even failure.This study addresses the issue of high temperature in module design by utilizing IR-Drop analysis and thermal simulation iteration through SIwave and Icepak simulation software from ANSYS for electro-thermal co-simulation of PCB.The differences between pure thermal simulation and electro-thermal co-simulation are com-pared.An overall simulation model is established to investigate the internal temperature field of a 10 GB Ethernet module under actual working conditions and verify the effectiveness of using thermal conductive gaskets to improve heat dissipation within the module.By comparing monitoring point temperature data obtained from both simulations and experimental tests at different temperatures,there is less than 7%error between simulated results and measured temperatures.
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