Design and Improvement of a Dual-cavity SIP Potting Process
Encapsulation is an very important technology in module encapsulation.Different modules have different re-quirements for encapsulation technology.In this paper,the encapsulation technology of a dual-cavity structure base-plate SIP module is discussed.The selection,operation method and reliability evaluation test of potting material are carried out in the aspects of both electrical performance,heat dissipation,environmental adaptability and maintainability.According to the test results,the design and improvement of the potting process of this SIP module are preliminarily completed.
system in package(SIP)potting processreliability test
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