一种双腔体SIP灌封工艺设计与改进
Design and Improvement of a Dual-cavity SIP Potting Process
王仕权 1严晓洁 1程志远1
作者信息
- 1. 中国电子科技集团公司第五十八研究所,江苏 无锡 214072
- 折叠
摘要
灌封是模块封装工艺中一种十分重要的环节,不同结构特性的模块对灌封工艺要求均有不同.介绍了一款双腔结构基板型SIP模块灌封工艺,在兼顾电性能、散热、环境适应性、可维护性等方面进行了灌封材料选型、操作方法及可靠性评估试验.根据试验结果,完成了此SIP模块的灌封工艺设计和改进.
Abstract
Encapsulation is an very important technology in module encapsulation.Different modules have different re-quirements for encapsulation technology.In this paper,the encapsulation technology of a dual-cavity structure base-plate SIP module is discussed.The selection,operation method and reliability evaluation test of potting material are carried out in the aspects of both electrical performance,heat dissipation,environmental adaptability and maintainability.According to the test results,the design and improvement of the potting process of this SIP module are preliminarily completed.
关键词
系统级封装/灌封工艺/可靠性试验Key words
system in package(SIP)/potting process/reliability test引用本文复制引用
出版年
2024
NETL
NSTL
万方数据