首页|微电解技术对调相机站循环冷却水降垢杀菌作用的试验研究

微电解技术对调相机站循环冷却水降垢杀菌作用的试验研究

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采用微电解方法处理调相机站循环冷却水,研究了微电解电流密度和水力停留时间对冷却水硬度和杀菌效果的影响.结果表明,水质硬度去除率与微电解电流密度和水力停留时间正相关.在电流密度为0.1 mA/cm2的条件下,当水力停留时间从10 min增加到20 min时,循环水硬度去除率从1.39%提高到2.77%.在水力停留时间为10 min的条件下,当电流密度从0.02 mA/cm2增加到0.3 mA/cm2时,循环水硬度去除率从0.2%提高到6.9%.当水力停留时间为15 min,电流密度达到0.43 mA/cm2时,杀菌率达到99.55%.试验表明延长水力停留时间或者增加电流密度,杀菌效果相应地随之增强.在实际工业应用中,可以根据实际需要来调节加在电极上的电流、电压及水样在装置中的水力停留时间,以达到合适的水质硬度去除率和杀菌效果.
Experimental study on effect of micro-electrolysis technology on scale reduction and sterilization of circulating cooling water in condenser station
Using micro-electrolysis technology to treat circulating cooling water of rotary condenser station,the influence of micro-electrolytic current density and hydraulic residence time(HRT)on hardness and steriliza-tion effect of cooling water was investigated.The results showed that,the reduction rate of water hardness was positively correlated with microelectrolytic current density and HRT.When the HRT increased from 10 min to 20 min,the reduction rate of circulating water hardness increased from 1.39%to 2.77%.When the HRT was 10 min,the current density increased from 0.02 to 0.3 mA/cm2,the hardness of the circulating water was increased from 0.2%to 6.9%.When the HRT was 15 min,the current density reached 0.43 mA/cm2,the sterilizing rate reached 99.55%.The experiment indicated that,sterilizing rate increased with the prolonging of the HRT or the increasing of the current density.In industrial application,proper water hardness reduction rate and sterilizing effect could be obtained through adjusting electricity and voltage of the electrode,and adjusting HRT of the water sample in the equipment at the same time.

microelectrolysisrotary condenser stationcirculating cooling waterhardnessscale reductionsterilizationcorrosion protection

董锐锋、李夏、伍阳雪、夏大伟、赵光金、王放放、胡玉霞

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国网河南省电力公司电力科学研究院,郑州 450052

国网河南省电力公司超高压公司,郑州 450064

武汉大学资源与环境科学学院,武汉 430072

微电解 调相机站 循环冷却水 硬度 降垢 杀菌 防腐

国家电网有限公司科技指南项目

52170221000Z

2024

工业用水与废水
东化工程科技股份有限公司

工业用水与废水

CSTPCD
影响因子:0.649
ISSN:1009-2455
年,卷(期):2024.55(2)
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