首页|不同表面状态的氮化铝薄膜电路制备研究

不同表面状态的氮化铝薄膜电路制备研究

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氮化铝陶瓷是薄膜电路常用的主要基材,常见的产品分类有薄膜电阻器、薄膜功分器、薄膜衰减器、通孔薄膜电路等,其中电阻器是其中的一个大分类。对于薄膜电阻器而言,耐功率是一项重要参数。耐功率通常指直流功率和射频功率两种,但因射频的频率范围大,参数影响多,所以通常耐功率一般指的是直流条件下测试的功率,即在电阻器的电极两端导通至电源的正负极,调电压大小,通电一定的时间,电阻体烧毁时的瞬时电压、瞬电流之积。通孔薄膜电路通常最重要的指标是线缝宽精度及孔的激光加工精度,这两项加工精度对产品的微波性能影响较大。陶瓷一般分为片抛光态、即烧态和研磨态,陶瓷的表面状态直接影响薄膜电路产品的外观、质量。
Introduction of Production Process of Ceramic Film Circuit
Aluminum nitride ceramics are the main substrate commonly used in thin film circuits.Common product categories include thin film resistors,thin film power dividers,thin film attenuators,through hole thin film circuits,etc.Among them,resistors are one of the major categories.For thin film resistors,power resistance is an important parameter.Endurance usually refers to two types of power:DC power and RF power.However,due to the large frequency range and multiple parameter influences of RF,endurance generally refers to the power tested under DC conditions,which is the instantaneous voltage and instantaneous current product when the resistor is burned out by conducting the positive and negative electrodes of the resistor to the positive and negative poles of the power supply,adjusting the voltage size,and applying it for a certain period of time.The most important indicators for through-hole thin film circuits are usually the precision of line gap width and the laser processing accuracy of holes,which have a significant impact on the microwave performance of the product.Ceramics are generally divided into polished state,Sintered state,and ground state,and the surface state of ceramics directly affects the appearance and quality of thin film circuit products.

thin film processpreparation of aluminum nitride ceramicsroughnessprecision of line gap widthsurface condition

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广州天极电子科技股份有限公司,广东 广州 510000

薄膜工艺 氮化铝陶瓷制备 粗糙度 线缝宽精度 表面状态

2025

广州化工
广州市化工行业协会 广州市化学化工学会 广州市化学工业研究所

广州化工

影响因子:0.358
ISSN:1001-9677
年,卷(期):2025.53(1)