In the paper,the quality of vacuum vapor reflow soldering of FCCGA devices was studied.In view of the particularity of the device packaging,through the analysis of the soldering mechanism,the optimization scheme of soldering parameters was put forward.Starting from the aspects of solder paste thickness,soldering process parameters and temperature gradient,the optimal soldering parameters were obtained through four process verification tests,and the temperature gradient control methed of the device body was mastered,so as to ensure that the vacuum vapor reflow soldering quality of FCCGA device met the process requirements.
关键词
FCCGA/真空汽相再流焊/工艺参数/焊接试验/质量控制
Key words
FCCGA/vacuum vapor reflow soldering/process parameters/soldering experiment/quality control
维普
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