Vacuum vapor reflow soldering process and quality control of FCCGA devices
In the paper,the quality of vacuum vapor reflow soldering of FCCGA devices was studied.In view of the particularity of the device packaging,through the analysis of the soldering mechanism,the optimization scheme of soldering parameters was put forward.Starting from the aspects of solder paste thickness,soldering process parameters and temperature gradient,the optimal soldering parameters were obtained through four process verification tests,and the temperature gradient control methed of the device body was mastered,so as to ensure that the vacuum vapor reflow soldering quality of FCCGA device met the process requirements.
FCCGAvacuum vapor reflow solderingprocess parameterssoldering experimentquality control
万方数据
维普
