Effect Study of Encapsulating Adhesive Materials on the Performance of High-Temperature Pressure Sensors
The packaging structure of SOI high-temperature pressure sensors is an important factor affecting its stable operation in high-temperature environments.In this paper,based on an SOI chip,inorganic high-emperature adhesive,epoxy resin and glass paste were used as packaging and bonding materials,and three high-temperature pressure sensors were prepared from each material.After a 300℃@100 h online test,the results showed that the average zero output drift of the high-temperature pressure sensor prepared by inorganic high-temperature adhesive,epoxy resin and glass paste was about 0.019 05,1.649 65 and 0.066 93 mV/h,within 300℃@100 h,respectively.The average integrated repeatability,hysteresis and linearity were 1.062%,4.932%and 1.857%,respectively.The experimental results show that the smaller the coefficient of thermal expansion,the smaller the influence on the output performance of the sensor at high temperatures.
SOI high-temperature pressure sensorencapsulation bonding materialcoefficient of thermal expansion
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