氟碳型表面活性剂浓度对离子钯活化液活性的影响
Effect of surfactant concentration on the activity of ionic palladium activation solution
曾洪涛 1刘艺哲 2王泽娟 2王艳辉 2赵雷杰 2陈兵3
作者信息
- 1. 华南理工大学 化学与化工学院,广东 广州 510641;河北工程大学 机械与装备工程学院,河北 邯郸 056038;台山市精诚达电路有限公司,广东 台山 529223
- 2. 河北工程大学 机械与装备工程学院,河北 邯郸 056038
- 3. 台山市精诚达电路有限公司,广东 台山 529223
- 折叠
摘要
采用离子钯活化液进行绝缘基材化学镀铜前的表面活化,探究不同浓度的氟碳型表面活性剂对离子钯活化液活化效果的影响.利用激光共聚焦显微镜(CLSM)分析化学镀铜后基材表面粗糙度,采用扫描电子显微镜(SEM)表征化学镀铜后的形态和结构,结合X射线能谱仪(EDS)检测样品表面元素含量,对化学镀铜后的基材表面进行背光测试及电化学分析.结果表明:氟碳型表面活性剂存在临界浓度0.01 g/L,氟碳型表面活性剂浓度由0.001 g/L增加至0.01 g/L时,离子钯活化液活化效果随表面活性剂浓度的增加而提高,但氟碳型表面活性剂浓度由0.01 g/L继续增加至1 g/L时,离子钯活化液的活性效果反而降低,当氟碳型表面活性剂的浓度为临界浓度0.01 g/L时,离子钯活化液的活性最高,化学镀铜的效果最好.
Abstract
The surface activation of insulating substrate before electroless copper plating was carried out by using ionic palladium activation solution.The effects of different activation solutions were investigated.The surface roughness of the substrate after electroless copper plating was analyzed by confocal laser scanning microscopy(CLSM).The morphology and structure of the substrate after electroless copper plating were characterized by scanning electron microscopy(SEM).The content of elements on the surface of the sample was detected by X-ray energy dispersive spectrometer(EDS).The surface of the substrate after electroless copper plating was tested by backlight and electrochemical analysis.The results show that there is a critical concentration of 0.01 g/L for fluorocarbon surfactant.When the concentration of surfactant in-creases from 0.001 g/L to 0.01 g/L,the activation effect of ionic palladium activation solution will increase with the in-crease of surfactant concentration.When the concentration of surfactant continues to increase from 0.01 g/L to 1 g/L,the activity of ionic palladium activation solution will decrease with the increase of surfactant concentration.When the con-centration of surfactant is 0.01 g/L,the activity of ionic palladium activation solution is the highest,and the effect of elec-troless copper plating is the best.
关键词
离子钯活化液/化学镀铜/表面活性剂/活化效果/电化学分析Key words
ionic palladium activation solution/electroless copper plating/surfactant/activation effect/electrochemical analysis引用本文复制引用
基金项目
国家自然科学基金资助项目(52001105)
河北省自然科学基金资助项目(E2022402107)
河北省高等学校科学技术研究项目(QN220136)
出版年
2024
NETL
NSTL
万方数据