Effect of surfactant concentration on the activity of ionic palladium activation solution
The surface activation of insulating substrate before electroless copper plating was carried out by using ionic palladium activation solution.The effects of different activation solutions were investigated.The surface roughness of the substrate after electroless copper plating was analyzed by confocal laser scanning microscopy(CLSM).The morphology and structure of the substrate after electroless copper plating were characterized by scanning electron microscopy(SEM).The content of elements on the surface of the sample was detected by X-ray energy dispersive spectrometer(EDS).The surface of the substrate after electroless copper plating was tested by backlight and electrochemical analysis.The results show that there is a critical concentration of 0.01 g/L for fluorocarbon surfactant.When the concentration of surfactant in-creases from 0.001 g/L to 0.01 g/L,the activation effect of ionic palladium activation solution will increase with the in-crease of surfactant concentration.When the concentration of surfactant continues to increase from 0.01 g/L to 1 g/L,the activity of ionic palladium activation solution will decrease with the increase of surfactant concentration.When the con-centration of surfactant is 0.01 g/L,the activity of ionic palladium activation solution is the highest,and the effect of elec-troless copper plating is the best.
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