河北科技大学学报(社会科学版)2024,Vol.24Issue(2) :8-18.DOI:10.7535/j.issn.1671-1653.2024.02.002

科技创新对城市经济韧性的空间溢出效应研究——兼论金融集聚的调节作用

Research on the Spatial Spillover Effect of Technological Innovation on Urban Economic Resilience:Also on the Regulating Effect of Financial Agglomeration

李泉 安培培
河北科技大学学报(社会科学版)2024,Vol.24Issue(2) :8-18.DOI:10.7535/j.issn.1671-1653.2024.02.002

科技创新对城市经济韧性的空间溢出效应研究——兼论金融集聚的调节作用

Research on the Spatial Spillover Effect of Technological Innovation on Urban Economic Resilience:Also on the Regulating Effect of Financial Agglomeration

李泉 1安培培1
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作者信息

  • 1. 兰州大学 经济学院,甘肃 兰州 730000
  • 折叠

摘要

基于2008-2021年277个地级及以上城市的面板数据,运用双向固定效应空间杜宾模型,分析科技创新对城市经济韧性的影响及其作用机制.结果表明:科技创新能够显著提高城市经济韧性,并对周边城市产生正向空间溢出效应;分时期看,科技创新在冲击抵御与恢复调整两个阶段对城市经济韧性均有显著促进作用;调节效应检验发现,金融集聚能够强化科技创新对城市经济韧性的促进作用.因此,持续推进科技创新水平、不断优化金融资源配置效率和增强金融对科技创新的支持力度,对于提升城市经济韧性至关重要.

Abstract

Based on panel data from 277 prefecture-level cities and above from 2008 to 2021,a two-way fixed effects spatial Durbin model was used to analyze the impact and mechanism of technological innovation on urban economic resilience.The results show that technological innovation significantly enhances urban economic resilience and has a positive spatial spillover effect on neighboring cities;In different periods,technological innovation significantly promotes urban economic resilience in both shock resistance and recovery adjustment phases;The test for moderating effects reveals that financial agglomeration strengthens the positive impact of technological innovation on urban economic resilience.Therefore,it is crucial to continuously advance the level of technological innovation,optimize the efficiency of financial resource allocation,and enhance the support of finance for technological innovation in order to enhance urban economic resilience.

关键词

科技创新/金融集聚/城市经济韧性/空间杜宾模型

Key words

technological innovation/financial agglomeration/urban economic resilience/spatial Durbin model

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基金项目

甘肃省软科学研究计划(22JR4ZA047)

出版年

2024
河北科技大学学报(社会科学版)
河北科技大学

河北科技大学学报(社会科学版)

CHSSCD
影响因子:0.353
ISSN:1671-1653
参考文献量28
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