Study on thermal cycling reliability in SnAgCu/SnBi mixed solder joints
Mixed solder joints are the Sn-Ag-Cu bump with high melting point which is reflowed on PCB by Sn-Bi low temperature paste.This paper mainly studies the thermal cycling reliability of Sn-Ag-Cu/Sn-Bi structural mixed solder joints.Finite element method is employed to investigate the strain distribution in mixed solder joints.The results show that the thermal cycling reliability of the structural composite solder joint is better than that of Sn-Ag-Cu.This is mainly affected by the Sn-Bi solder layer which could narrow the range of non-elastic strain.The non-elastic strain range of structure composite solder joint with 50％Sn-Bi is lower than that of Sn-Ag-Cu solder joint.
mixed solder jointPb-free solderreliabilitythermal cyclingfinite element method
万方数据
维普
