Performance investigation of bonded manifold microchannel heat exchanger with high aspect ratio
T he rapid development of semiconductors and other micro-scale electronic technologies has led to a dramatic increase in chip power density.The increase in power poses a severe challenge to the heat dissipation of electronic devices,and microchannel heat exchangers can effectively solve the heat dissipation problem of these devices.In this paper,a bonded manifold microchannel heat exchanger was developed with a size of 13.00 mm×12.00 mm×0.88 mm and an aspect ratio(AR)of microchan-nels of up to 10.5.The thermal and hydraulic performance of the cooling module was evaluated in terms of hot spot temperature,thermal resistance,and system pressure drop.The results show that when deionized water is used as the working medium and the water flow is 150 mL/min,the heat ex-changer dissipates up to 1 200 W/cm heat flux at a chip temperature of 82.1 ℃,a total thermal re-sistance of 0.052 cm2·K/W and a pressure drop of 260 kPa.The present work provides a new strate-gy for using single-phase water to cool power electronics with high heat flux.
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维普
