Study on the Preparation Technology of Medium Temperature Curing Modified Phenolic Adhesive with High Temperature Resistance
The traditional phenolic adhesive is easy to decompose and lose its bond strength at high temperature,which limits its application at high temperature.Therefore,it is particularly important to develop a modified phenolic adhesive that can cure at medium temperature and has good high temperature resistance.In this paper,the phenolic adhesive with excellent high temperature resistance was obtained by introducing a special modifier to modify the phenolic resin under the condition of medium temperature curing.
phenolic adhesivemedium temperature curinghigh temperature resistancemodification
万方数据
维普
