The traditional phenolic adhesive is easy to decompose and lose its bond strength at high temperature,which limits its application at high temperature.Therefore,it is particularly important to develop a modified phenolic adhesive that can cure at medium temperature and has good high temperature resistance.In this paper,the phenolic adhesive with excellent high temperature resistance was obtained by introducing a special modifier to modify the phenolic resin under the condition of medium temperature curing.
关键词
酚醛胶粘剂/中温固化/耐高温/改性
Key words
phenolic adhesive/medium temperature curing/high temperature resistance/modification
维普
万方数据