Progress of chip-level indirect liquid cooling technology and enhanced heat transfer in data centers
In order to meet the operational requirements of high-heat-flux data centers,liquid cooling technology has gotten more and more attention and research efforts from scholars worldwide.Indirect liquid cooling is regarded as more efficient and energy-saving compared to traditional air cooling methods.However,its heat exchange capabilities are somewhat diminished in comparison to direct liquid contact methods,making the heat transfer enhancement a focal point of research in the realm of indirect liquid cooling.Additionally,indirect liquid cooling presents safety and cost-related challenges,such as liquid leakage and system complexity.Therefore,the integration of different technologies based on their respective strengths and weaknesses has become a meaningful research direction for current data center cooling systems.In this article,a comprehensive review of these key aspects is conducted.The current status and research advancements in the application of single-phase,two-phase,and heat pipe cooling in chip-level data center cooling are thoroughly analyzed.The pathways for enhancing heat transfer in chip-level indirect liquid cooling are outlined from three aspects:fluid dynamics,medium materials,and channel design optimization.Furthermore,the coupling of different technologies for chip-level data center cooling methods has also been organized,primarily including single-phase cooling and heat pipe cooling,along with the use of phase-change materials in conjunction with these methods to enhance energy efficiency and effectiveness.In the future,indirect liquid cooling in data centers still needs to be expanded in the direction of heat dissipation efficiency improvement and technology composite.This study provides a valuable reference for improving the cooling efficiency of high-temperature data centers and expanding the application of indirect liquid cooling technology.
万方数据
维普
