Study on cooling characteristics of chip array based on microencapsulated phase change material slurry
In view of the fact that the traditional discrete phase model(DPM)cannot accurately predict the pressure drop of microencapsulated phase change material slurry(MEPCMS)because it does not consider the effect of particle volume,the modified DPM is used to accurately predict the flow heat transfer characteristics of MEPCMS in the chip array,and the influence of chip heating power and power distribution on cooling characteristics is investigated.The results show that compared to pure base liquid cooling,the suspension can increase the average Nusselt number Nuav of MEPCMS by up to 30.03％,resulting in a maximum decrease of △Tw by 7.19％.The comprehensive performance evaluation factors of the suspension are all greater than 1.The closer the high-power chip is to the inlet,the more favorable it is to suppress the highest temperature rise of the chip.When a high-power chip approaches the outlet,the Nuav increase of the suspension is greater than the increase in friction factor and inlet/outlet pressure drop.Therefore,it is obvious that it is less affected by the chip heating power and more affected by the chip power distribution.This work helps to understand the heat transfer characteristics and influence laws of MEPCMS in chip thermal management.
microencapsulated phase change material slurrymicrochannelschip thermal managementparticle flownumerical simulation
万方数据
维普
