In order to achieve high heat flux electronic device cooling,HFE-7100 was used as the working fluid to conduct an experimental study on the flow boiling characteristics of three wedge-shaped manifold microchannels and compared them with conventional rectangular manifold microchannels.The effects of two manifold configurations and two surface enhancement structures on the boiling heat transfer coefficients,critical heat fluxes and flow pressure drops under different flow rates and inlet subcooling are discussed.The experimental results show that the wedge-shaped manifold can promote the transition of flow pattern from churn flow to annular flow,and increase the fluid transport efficiency and vapor discharge efficiency,thus improving the heat transfer performance while reducing the flow pressure drop.Compared with the micro-pin-fin enhancement structure,the porous surface processed by femtosecond laser provides a simple and convenient method to enhance the boiling heat transfer,which can greatly expand the heat transfer surface,provide a large number of nucleation sites,and significantly increase the CHF.Combining the wedge-shaped manifold with porous microchannels,the average two-phase heat transfer coefficient of the manifold microchannels is increased by 21.6％,the critical heat flux is increased by 30.4％,and the two-phase pressure drop is reduced by 12.7％,which realizes a significant improvement in the comprehensive performance of manifold microchannel heat sinks.
维普
万方数据