In response to the difficulty in evaluating the lifespan of long-life electronic devices in engineering practice,a physical and chemical relationship between the lifespan consumption of electronic devices and the composite stress of temperature and humidity is established based on the Peck model.The acceleration factor of electronic devices under accelerated test stress relative to normal working environment is obtained.Combining exponential distribution and reliability identification and acceptance test theory,the equivalent conversion relationship of lifespan consumption is established using the acceleration factor.The acceleration lifespan test time of electronic devices is calculated.By increasing the stress level endured,stimulating weak links,and improving the test efficiency,the lifespan of electronic devices is verified to meet the reliability requirements of development in a relatively short test time.
维普
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