DBC陶瓷基板表面贴装工艺技术研究
The Research of Heat Dissipation Performance for Power Controller Tightness Based on ICEPAK
王珂 1朱景春 1周鹏伟 1刘涛 1刘聪1
作者信息
- 1. 上海空间电源研究所,上海 200245
- 折叠
摘要
高效散热对宇航控制单机的热设计尤为重要,本文选用氧化铝DBC替代FR4印制板,研究基于热风回流焊的陶瓷基板焊接方法,通过对陶瓷基板焊盘和锡膏印刷钢网进行合理优化设计,增加排气通道,有效降低了焊接整体空洞率;探讨了底板厚度对焊接后平面的影响;最后通过环境试验考核对焊接可靠性进行了验证,为空间用电子单机的陶瓷组件焊接方法提供参考.
Abstract
Efficient heat dissipation is particularly important for the thermal design of aerospace controllers.In this paper,aluminum oxide DBC is selected to replace the FR4 printed board,and the welding method of ceramic substrate based on hot air reflow is studied.Through reasonable optimization design of ceramic substrate pad and solder paste printing steel mesh,the exhaust channel is increased,and the overall cavity rate of welding is effectively reduced.The influence of the thickness of bottom plate on the flatness after welding is discussed.Finally,the welding reliability is verified by environmental test,which provides a reference for the welding method of ceramic substrate assembly in space electronic single machine.
关键词
陶瓷基板组件/热风回流焊/氧化铝DBC/散热Key words
ceramic substrate assembly/hot air reflow welding/DBC/heat dissipation引用本文复制引用
出版年
2024
NETL
NSTL
维普
万方数据