The Research of Heat Dissipation Performance for Power Controller Tightness Based on ICEPAK
Efficient heat dissipation is particularly important for the thermal design of aerospace controllers.In this paper,aluminum oxide DBC is selected to replace the FR4 printed board,and the welding method of ceramic substrate based on hot air reflow is studied.Through reasonable optimization design of ceramic substrate pad and solder paste printing steel mesh,the exhaust channel is increased,and the overall cavity rate of welding is effectively reduced.The influence of the thickness of bottom plate on the flatness after welding is discussed.Finally,the welding reliability is verified by environmental test,which provides a reference for the welding method of ceramic substrate assembly in space electronic single machine.
ceramic substrate assemblyhot air reflow weldingDBCheat dissipation
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NSTL
万方数据
维普
