Analysis and Improvement About Open Circuit Fault of One Type MIC Control Board
This paper introduces analysis and improvement process of one type of MIC control board.Through research and analysis,we found that the open circuit fault is caused by and SMT false welding and bonding process defects of silicon wheat chip.The Researchers used failure analysis methods,including appearance inspection,electrical performance test,X-ray fluoroscopy,CT scan inspection and section analysis,determined the analysis means and methods and find out the root cause of failure.After the manufacturer accepted the suggestion and improved the product,the similar failure was avoided again.
silicon wheat chipfailure analysisfalse solderingopen circuitroot cause
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