首页|无机填料复合比例对复合薄膜性能的影响

无机填料复合比例对复合薄膜性能的影响

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本工作基于导热复合薄膜性能的研究,提供了一种新型导热复合薄膜的制备方法.通过将不同添加量的氮化硼(BN)和二氧化硅(SiO2)加入到聚丁二烯树脂(PB)中,结合涂覆工艺制备了高导热BN/SiO2 填充的复合薄膜材料.系统研究了不同添加量BN对BN/SiO2 填充的复合薄膜材料的微观形貌、导热性能、介电性能、抗剥性能和热膨胀系数的影响.结果表明:随着BN含量的增大,复合薄膜表面缺陷逐渐增加,介电常数略有下降,介电损耗略有升高,抗剥强度也下降,X-Y-Z轴的热膨胀系数也都逐渐增大.最终,当BN/SiO2 添加质量比例为 10∶30 时(BN添加量为 10%),BN/SiO2 填充的复合薄膜材料的综合性能表现最佳,导热系数为 0.75 W m-1K-1,介电常数为 3.20,介电损耗因子为 3.12*10-3,抗剥强度为 2.2 Nm-1,和适宜的热膨胀系数.有望为新型高导热复合薄膜材料的开发提供一种新的实用型思路.
Effect of Composite Proportion of Inorganic Fillers on Properties of Composite Films
Based on the study of the properties of thermal conductive composite films,a new preparation method of thermal conductive composite films is provided in this work.By adding boron nitride(BN)and silicon dioxide(SiO2)to polybutadiene resin(PB),the high thermal conductivity BN/SiO2 filled composite film was prepared by coating process.The effects of different addition amounts of BN on the microstructure,thermal conductivity,dielectric properties,stripping resistance and thermal expansion coefficient of BN/SiO2 filled composite films were systematically studied.The results show that with the increase of BN content,the surface defects of the composite films increase gradually,the dielectric constant decreases slightly,the dielectric loss increases slightly,the stripping strength also decreases,and the thermal expansion coefficient of X-Y-Z axis also increases gradually.Finally,when the BN/SiO2 added mass ratio is 10∶30(BN added amount is 10% ),the composite film filled with BN/SiO2 has the best comprehensive performance,the thermal conductivity is 0.75 W m-1K-1,the dielectric constant is 3.20,and the dielectric loss factor is 3.12*10-3.The stripping strength is 2.2 Nm-1,and the coefficient of thermal expansion is suitable.It is expected to provide a new practical idea for the development of novel high thermal conductivity composite film materials.

polybutadiene resinboron nitridesilicadielectric propertiesthermal conductivity

王淼

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中国电子科技集团公司第十三研究所,石家庄 050051

聚丁二烯树脂 氮化硼 二氧化硅 介电性能 导热性能

2024

环境技术
广州电器科学研究院有限公司

环境技术

CSTPCD
影响因子:0.995
ISSN:1004-7204
年,卷(期):2024.42(5)
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