Research on PCB Material Characterization Electromagnetic Methodologies for High-Speed Interconnects
With the ever-increasing data rate,signal integrity design and optimization for high-speed interconnects has become crucial.Among all the aspects of successful high-speed channel design,we address a critical problem of accurate PCB material characterization through an overview of the proposed Electromagnetic methodologies.Various approaches for the extraction of PCB material properties,namely,dielectric constant,loss tangent,and copper surface roughness,are first classified into two main categories:① characterization techniques for raw dielectric materials;②methodologies feasible for PCB materials which are generally regarded as composites of glass fiber and resin.In each category,several popular techniques are briefly described,and the pros and cons are compared and discussed.The challenges and limitations of transmission-line based methods are of special interest herein,given that the associated material property extraction procedures have been common practice in industries.In addition,the impact of surface roughness of typical copper foils on accurate material characterization,especially in the frequency range of tens of giga hertz,is also examined.This paper is aiming to provide a comprehensive overview and insights of the material characterization methodologies through the summaries and comparisons.
causalitydielectric constantloss tangentmaterial characterizationsurface roughnessS-parametersplit-post dielectric resonatortransmission line
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